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Table 2 Comparison between the five groups according to adhesive remnant index

From: Assessment of chemical, ultrasonic, diode laser, and Er:YAG laser application on debonding of ceramic brackets

Adhesive remnant index

Group I (Control) (n = 20)

Group II (chemical aided debonding) (n = 20)

Group III (ultrasonic aided debonding) (n = 20)

Group IV (diode laser aided debonding) (n = 20)

Group V (Er:YAG laser aided debonding) (n = 20)

χ2 (MCp)

No

%

No

%

No

%

No

%

No

%

0

0

0.0

0

0.0

0

0.0

0

0.0

0

0.0

25.609

(0.001*)

1

14

70.0

13

65.0

10

50.0

10

50.0

3

15.0

2

6

30.0

7

35.0

9

45.0

7

35.0

8

40.0

3

0

0.0

0

0.0

1

5.0

3

15.0

9

45.0

p0

 

0.736

MCp = 0.335

MCp = 0.184

MCp = 0.0002*

 

MCp1

  

0.533

0.241

0.0002*

 

Sig. bet. grps

  

MCp2 = 0.606, p3 = 0.006*, p4 = 0.033*

 
  1. χ2: Chi square test; MC Monte Carlo
  2. p: p value for comparing between the studied groups
  3. p0: p value for comparing between Control and each other group
  4. p1: p value for comparing between Peppermint oil and each other group
  5. p2: p value for comparing between Ultrasonic and Diode Laser
  6. p3: p value for comparing between Ultrasonic and Er: YAG Laser
  7. p4: p value for comparing between Diode Laser and Er: YAG Laser
  8. *Statistically significant at p ≤ 0.05