Adhesive remnant index | Group I (Control) (n = 20) | Group II (chemical aided debonding) (n = 20) | Group III (ultrasonic aided debonding) (n = 20) | Group IV (diode laser aided debonding) (n = 20) | Group V (Er:YAG laser aided debonding) (n = 20) | χ2 (MCp) | |||||
---|---|---|---|---|---|---|---|---|---|---|---|
No | % | No | % | No | % | No | % | No | % | ||
0 | 0 | 0.0 | 0 | 0.0 | 0 | 0.0 | 0 | 0.0 | 0 | 0.0 | 25.609 (0.001*) |
1 | 14 | 70.0 | 13 | 65.0 | 10 | 50.0 | 10 | 50.0 | 3 | 15.0 | |
2 | 6 | 30.0 | 7 | 35.0 | 9 | 45.0 | 7 | 35.0 | 8 | 40.0 | |
3 | 0 | 0.0 | 0 | 0.0 | 1 | 5.0 | 3 | 15.0 | 9 | 45.0 | |
p0 | 0.736 | MCp = 0.335 | MCp = 0.184 | MCp = 0.0002* | |||||||
MCp1 | 0.533 | 0.241 | 0.0002* | ||||||||
Sig. bet. grps | MCp2 = 0.606, p3 = 0.006*, p4 = 0.033* |